A couple of days ago, Samsung announced its capability to mass manufacture silicon (processor chips) using a smaller and more efficient 10 nanometer process. Today they are also announcing that they have made 8GB Low Power Double Data Rate 4 (LPDDR4) packages made under the same 10nm process to complement the new next gen processors.
These new RAM packages are targeted to overtake the standard 4GB LPDDR4 packages being used today which are made using a 20nm process. This means that these new 8GB packages are smaller – 15nm x 15nm and 1.0mm thin – than the current gen RAM packages. The 1.0mm profile satisfies the requirements for most ultra slim devices, and you can even stack packages together to save on space on the circuit board, or put the application processor on top of it.
Given those dimensions, these new LPDDR4 packages are still speedy, operating at up to 4,266 Mbps which is twice faster than most RAM modules used in a PC. This will give tablets, smartphones, and other mobile devices the capability to process faster and put out video applications in higher resolutions (like 4K video) and in smoother frame rates.
Expect these new modules to partner the new 10nm processors as well, with Qualcomm’s Snapdragon 830 at the head of the line there. These new elements should be in devices starting Q1 of 2017.